Home > Search Results: keywords:"Bi-material junction"
Search:
Search Tips :: Advanced Search
Search collections:
Sort by: Display results: Output format:
National Repository of Grey Literature 1 records found  Search took 0.01 seconds. 
Multi-parameter based stress distribution in vicinity of sharp material inclusion tip
 Krepl, Ondřej ; Klusák, Jan
General Singular Stress Concentrators (GSSCs) which exhibit singular stress concentration are often responsible for crack initiation and thus failure of the component. The GSSC of the type of bonded bi-material junction occurs in a variety of technical applications including but not limited to sharp material inclusions, silicate based composites and electronic components. The GSSC cannot be assessed by means of standard fracture mechanics. Approaches of generalized fracture mechanics require precise description of stress distribution near the stress concentration points. In order to determine the stress field accurately, the paper incorporates the multi-parameter based description.
Detailed record

Interested in being notified about new results for this query?
Subscribe to the RSS feed.
Digital Repository :: Search :: Submit :: Personalize :: Help
Powered by Invenio v1.1.2
Maintained by admin.invenio@techlib.cz
This site is also available in the following languages:
Česky  English